Ajinomoto confirms priority ABF film allocation for high-end AI, putting Taiwan substrate makers in focus
Ajinomoto, the dominant supplier of ABF film used in advanced IC substrates, has told customers it will shift to differentiated allocation because of raw material shortages, prioritizing AI and other high-end applications. A channel survey cited by Meritz Securities said the company’s ABF film lines are expected to be fully loaded through the second quarter of 2026, with little near-term relief from new capacity. The move matters because ABF film is a key insulating layer in FC-BGA packaging for CPUs, GPUs and AI accelerators. While it accounts for only a small part of substrate cost, supply disruptions can halt production lines. The report said Ajinomoto has maintained more than 95% global market share in the segment. The supply squeeze is already showing up in lead times and pricing. Lead times have stretched from three to four months at the start of the year to more than 12 months, and some customers are already discussing 2029 capacity. The article pointed to rising demand from larger AI chips, including NVIDIA’s next-generation Rubin GPU, and expanding CoWoS packaging capacity at TSMC. According to the report, Taiwan’s Unimicron, Nan Ya PCB and Kinsus could benefit first because they already have high-end production scale, yield performance and customer qualifications. At the same time, non-AI customers are likely to face reduced allocation, longer waits and higher costs, while glass substrates are not expected to become a volume replacement before 2027.




